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SHMat 2020 Spring First Call

创建时间:  2020年04月21日 15:41  黄浩斐    浏览次数:


上海材料前沿论坛2020年春季会议

2020428日,线上

第一轮通知


材料是社会发展的基石。一代新材料,造就一代新装备,引领一代新产业。新材料是国家战略性新兴产业,支撑了经济与社会发展。上海材料前沿论坛将立足于上海科创中心建设与长三角一体化提供的时代机遇,聚焦材料领域的前沿成果和发展趋势,聚集海内外材料领域的杰出科学家与工程师,搭建世界一流学术交流互动平台,促进材料领域的学术交流、思想碰撞与科研合作。论坛将邀请海内外知名学者,采用线上“云TALK”与线下论坛相结合的模式,交流最新研究动态,促进科研交流与合作,推进材料科学与技术的发展。

上海材料前沿论坛2020年春季会议将于2020428线上举行,以供参会学者足不出户通过因特网实现面对面的交流,探索特殊时期的高效交流模式。本次会议由上海大学材料科学与工程学院牵头举办,热忱欢迎海内外材料领域的专家学者莅临。



已确认的大会报告

(更多的大会报告正在确认中)

报告人

题  目

单位/职务

干  勇

新材料高质量发展战略研究

国家新材料产业发展专家咨询委员会主任

刘昌胜

待定

上海大学校长

刘  浏

大力发展转炉高废钢比冶炼工艺

江苏冶金技术研究院院长

朱美芳

杂化材料设计与功能纤维构筑

东华大学材料学院院长、纤维材料改性国家重点实验室主任

陈学思

生物医用高分子材料的制备及其应用

中科院长春应用化学研究所学术委员会副主任、中科院生态环境高分子材料重点实验室学委会副主任

孙宝德

待定

上海交大材料科学与工程学院院长

周少雄

固态储氢为氢源的燃料电池发展思考/New views on Fuel   cell with solid hydrogen storage as hydrogen source

江苏集萃安泰创明先进能源材料研究院院长

单爱党

Making Ultra-Strong Steel   via Phase-transformation Control of Deformed Metastable -Austenite

上海交大材料科学与工程学院书记

一、会议主题

聚焦材料科学与工程领域的发展前沿,研讨学术界与工业界科研热点与关键技术问题。

1、先进金属材料及工程

钢铁材料和有色金属材料的设计、生产、零件加工、服役评价等。

2、功能材料及技术

包括但不局限于智能无机材料、薄膜半导体材料与器件、光电材料与器件、热电材料与器件、先进能源材料、纳米功能材料、纳米结构与催化、环境材料等。

3、软物质材料

包括但不局限于仿生高分子材料、生物医用材料、有机生物电子材料、智能凝胶,超分子组装、柔性功能材料与器件、高分子化学、高分子化工、复合材料等。

4、纤维与低维材料

包括但不局限于高性能纤维与复合材料,功能纤维,光导纤维,超弹性导电纤维,有机-无机杂化低维材料,能量存储与转换材料,共轭高分子,有机多孔材料,二维高分子等。


分会场安排(拟)

分会场1

先进金属材料

分会场2

冶金工程技术

分会场3

功能材料与器件

分会场4

软物质材料

分会场5

纤维与低维材料

分会场6

材料基因组

分会场7

长三角材料技术产业链

二、主办单位

上海大学

中国工程科技知识中心材料分中心

三、协办单位

中国内燃机学会新材料与表面技术分会

东华大学 纤维材料改性国家重点实验室

上海工程技术大学

江苏冶金技术研究院

上海宝钢不锈钢有限公司

江苏集萃安泰创明先进能源材料研究院有限公司

宝钢特钢有限公司

上大新材料(泰州)研究院有限公司

腾讯云计算(北京)有限责任公司

四、会议组织机构

会议名誉主席:干勇

会议主席:刘昌胜

学术委员会:David A. Weitz、丁文江、干勇、叶明新、朱向阳、朱美芳、刘玠、刘昌胜、刘浏、江莞孙宝德、孙晋良、李劲、李春忠、吴明红、张弛、张统一、张荻、林绍梁、周邦新、周国治、周细应、单爱党、俞建勇、徐滨士、韩伟、鲁雄刚(按姓氏笔画排列)

组织委员会:马敬红、王刚、王江、王林军、王勇、韦习成、尹静波、吕战鹏、朱波、任忠鸣、刘文庆、刘福窑、许茜、杜娟、李文献、李红、李谋成、李喜、李谦、杨健、吴晓春、张阿方、张金仓、张登松、张耀鹏、钟云波、施利毅、施思齐、施鹰、骆军高彦峰、黄健、董瀚、鲁晓刚、廖耀祖、翟启杰、颜世峰(按姓氏笔画排列)

会议秘书处

秘书长:董瀚、朱波

副秘书长:廖耀祖、卫慧

学术领域秘书:彭伟、廉心桐、李传军、陈湘茹、郭凯、李亚捷、贾林、张坤玺、吴青、黄波、赖建明、姜沪、邹星礼、赵洪山、王春燕、陈宏飞、崔苑苑、陆恒昌、张银辉、徐龙云、帅三三、於乾英、滕晓黎、吴红敏

网络会议系统支持:杭坚 腾讯云计算(北京)有限责任公司

投稿联系人:

张月璐(上海大学)

电话:+86-15201930334 邮箱:zyl200612316@126.com

余淼淼(东华大学)

电话:+86-18801622879 邮箱:mmyu@dhu.edu.cn

会务联系人:熊婷婷

电话:+86-13671566828 邮箱:xiong03120254@126.com

五、会议语言

本次会议工作语言为中文或英文。

六、摘要投稿

欢迎国内外科学家及研究人员根据会议主题通过电子邮件投递英文大摘要,模板见附件一。

七、会议重要时间节点(以下按北京时间)

1202041-20日,有意参会者请发送英文大摘要(附件一)和报名表(附件二)至邮箱SHMat2020@126.com。邮件标题为“SHMat 2020 Spring-姓名”,报名表文件命名为“SHMat 2020 Spring-姓名”,大摘要文件命名为“SHMat 2020 Spring-abstract-姓名”。

22020420-25日,会议将对参会摘要进行评审,并通过电子邮件发送参会邀请信。

32020420-27日,参会者完成网上注册,本次会议不收取会议费。

4、会议时间:2020428日(全天)

                     

                       


《上海材料前沿论坛》组委会

202041

Shanghai Forum on Frontier Materials: 2020 Spring

April 28, 2020, Online

First Call

Materials form the foundament for human society. A new generation of materials may create a new generation of equipments, at the same time, lead to a new generation of industry development. Novel frontier materials can be an important driver for the strategic emerging industries. Shanghai Forum on Frontier Materials, promoted by the construction of Science and Innovation Center in Shanghai and the Yangtze River Delta, will provide exchange opportunities on the cutting-edge achievements and development trends in materials fields, gather international outstanding scientists and engineers in materials fields, build a world-class academic exchange and interaction platform to promote academic exchange, collision of ideas and research cooperation. The forum will invite renowned international scholars using the combined mode of online "cloud TALK" and offline forum, exchange the latest research trends, promote scientific research exchanges, interdisciplinary collaboration, and facilitate development of materials science and technology.

SHMat 2020 Spring will be held online on April 28, 2020, for participants to achieve face-to-face communication through the Internet, to explore an efficient communication mode at this special period. This forum will be hosted by School of Materials Science and Engineering, Shanghai University, to warmly welcome international outstanding scientists and engineers’ participation.

I. Forum Themes

Focusing on the frontiers of development in the fields of materials science and engineering, discussing research hotspots and key technical problems in both academia and industries.

Topic 1: Advanced Metallic Materials and Engineering

Alloying design, production and processing technologies, application properties characterization and evaluation of steels and non-ferrous metals, etc.

Topic 2: Functional Materials and Technology

Smart Inorganic Materials, Thin Film Semiconductor Materials and Devices, Optoelectronic Materials and Devices, Thermoelectric Materials and Devices, Advanced Energy Materials, Functional Nanomaterials, Nanostructures and Catalysis, Environmental Materials, etc.

Topic 3: Soft Matter

Biomimetic Polymer Materials, Biomedical Materials, Organic Bioelectronic Materials, Smart Gels, Supramolecular Assembly, Flexible Functional Materials and Devices, Polymer Chemistry, Polymer Materials, Composite Materials, etc.

Topic 4: Fibers and Low-dimensional Materials

High-Performance Fibers and Composite Materials, Functional Fibers, Optical Fibers, Elastic Conductive Fibers, Organic-Inorganic Hybrid Low-dimensional Materials, Energy Storage and Conversion Materials, Conjugated Polymers, Organic Porous Materials, Two-dimensional Polymers.

II. Sponsorship

Shanghai University

China Knowledge Centre for Engineering Sciences and Technology, Materials Branch

III. Co-sponsors

Advanced Materials and Surface Technology Sub-society of CSICE

Donghua University State Key Laboratory for Modification of Chemical Fibers and Polymer Materials

Shanghai University of Engineering Science

Jiangsu Industrial Technology Research Institute

Shanghai Baosteel Stainless Steel Co.

Jiangsu JITRI Advanced Energy & Materials Research Institute Co., Ltd.

Baosteel Special Steel Co.

Taizhou New Materials R&D Institution SHU

Tencent Cloud Computing (Beijing) Co.,Ltd

IV. Organizational Committees

Honorary Chairman of the Forum: Gan Yong

Chairman: Liu Changsheng

Academic Committee: David A. Weitz, Ding Wenjiang, Gan Yong, Ye Mingxin, Zhu Xiangyang, Zhu Meifang, Liu Jie, Liu Changsheng, Liu Liu, Jiang Wan, Sun Baode, Sun Jinliang, Li Jin, Li Chunzhong, Wu Minghong, Zhang Chi, Zhang Tongyi, Zhang Di, Lin Shaoliang, Zhou Bangxin, Zhou Guozhi, Zhou XiYing,  Shan Aidang, Yu Jianyong, Xu Binshi, Han Wei, Lu Xionggang.

Organizing Committee: Ma Jinghong, Wang Gang, Wang Jiang, Wang Linjun, Wang Yong, Wei Xicheng, Yin Jingbo, Lv Zhanpeng, Zhu Bo, Ren Zhongming, Liu Wenqing, Liu Fuyao, Xu Qian, Du Juan, Li Wenxian, Li Hong, Li Moucheng, Li Xi, Li Qian, Yang Jian, Wu Xiaochun, Zhang Afang, Zhang Jincang, Zhang Densong, Zhang Yaopeng, Zhong Yunbo, Shi Liyi, Shi Siqi, Shi Ying, Luo Jun, Gao Yanfeng, Huang Jian, Dong Han, Lu Xiaogang, Liao Yaozu, Zhai Qijie, Yan Shifeng.

Secretariat of the Forum

Secretary-General: Dong Han, Zhu Bo

Deputy Secretary-General: Liao Yaozu, Wei Hui

Secretaries in the academic field: Peng Wei, Lian Xintong, Li Chuanjun, Chen Xiangru, Guo Kai, Li Yajie, Jia Lin, Zhang Kunxi, Wu Qing, Huang Bo, Lai Jianming, Jiang Hu, Zou Xingli, Zhao Hongshan, Wang Chunyan, Chen Hongfei, Cui Yuanyuan, Lu Hengchang, Zhang Yinhui, Xu Longyun, Shuai Sansan, Yu Qianying, Teng Xiaoli, Wu Hongmin.

NetMeeting System Support: Hang Jian Tencent Cloud Computing (Beijing) Co.,Ltd

Abstract Liaison:

Zhang Yuelu (Shanghai University)

Tel: +86-15201930334  E-mail: zyl200612316@126.com

Yu Miaomiao (Donghua University)

Tel: +86-18801622879 E-mail: mmyu@dhu.edu.cn

Forum Liaison: Xiong Tingting

Tel: +86-13671566828 E-mail: xiong03120254@126.com

V. Forum Languages

The official languages will be English and/or Chinese.

VI. Abstract Submission

Domestic and abroad scientists and engineers are welcome to submit abstracts via email according to the forum themes. The abstract template can be found in Attachment I.

VII. Key Dates of the Forum (hereinafter in Beijing time)

1. From April 1st - 20, 2020, interested participants are invited to send the extended abstract (Attachment I) and the registration form (Attachment II) to email: SHMat2020@126.com. The email would be entitled "SHMat 2020 Spring-Participant Name", the registration form would be named "SHMat 2020 Spring-Participant Name", and the extended abstract would be named "SHMat 2020 Spring-abstract-Participant Name".

2. From April 20 – 25, 2020, abstracts will be reviewed and invitation letters will be sent via e-mail to the accepted participants.

3.From April 20 – 27, 2020, Participants complete online registration and no registration fee for the forum.

4. Forum time: April 28, 2020 (full day)

B6B1



Organization Committee of Shanghai Forum on Frontier Materials

April 1st, 2020